When it comes to electrical testing of any electrical products, there are many testing techniques involved for these detections. The printed circuit board (PCB) failure is one of them which take into account the flaws relating to material defects, faulty electrical connections and faults of physical breakdown. Semi conductors for PCB need to have the exact specifications as mentioned to possess the precise design properties. For quite a period of time now, electronic devices rely upon Integrated Circuits on PCB’s. Focusing on the fundamentals, one can say, more circuitry pressure in a smaller area increases density of the boards and different new errors arise on the go. Greater complexity leads to higher number of errors and small size of chip makes it all the more difficult to detect. It is here a probe head manufacturer can be helpful who can give the correct testing probe for easy detection and rectification.
Diagnosing the fault
PCB has its own conditions to work in. When trace materials are above the threshold, PCB does not work in the specified manner. Spotting the trace materials is the job of failure analysts. The complex nature of circuits creates many flaws which are very difficult to isolate. To perform the testing technique, a heat map of entire chip is created. If in any area, overheating is found, it is an indication of electrical fault. The actual problem might not be diagnosed but the concerned person gets the starting point to work upon. There are many types of flaws and cracks like fatigue cracks, brittle cracks, environment stress cracks and the solution for each of them differs accordingly.
